Thermal Conductive Diamond-High

Product introduction:
This product presents a crystalline form close to a cubo-octahedral, with low impurity content and high particle concentration.
It offers high stability and a high thermal conductivity coefficient.

Size Available: 35um-1300um

Application:
1.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc.
2.Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.