Product introduction:

This product presents a regular cubo-octahedral crystalline form, with extremely low impurity content.
It possesses a very high thermal conductivity coefficient, particle concentration, and product stability.

Size Available: 40um-1300um

Application:

1.Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.

Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc.

Product introduction:
This product presents a crystalline form close to a cubo-octahedral, with low impurity content and high particle concentration.
It offers high stability and a high thermal conductivity coefficient.

Size Available: 35um-1300um

Application:
1.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc.
2.Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.

Product introduction:
This product features a relatively regular crystalline form, low impurity content, and high particle concentration.
It has high stability and a high thermal conductivity coefficient, making it a preferred cost-effective filler option.

Size Available: 0.02um-350um

Application:
1.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal putty and etc.

Product introduction:
This product, processed via a special treatment, has a near-spherical crystalline form.
It features a high specific surface area, high particle concentration, low impurity content, good thermal conductivity, high flowability, and easy fillability.

Size Available: 30um-700um

Application:
1.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc.
2.Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.

Product introduction:
This product enhances the stable bonding between metals (such as copper and aluminum, etc) and diamond, reduces interfacial thermal resistance, and thereby improves heat dissipation effectiveness.

Size Available: 1um-1300um

Application:
1.Diamond Metal Matrix Composites（DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.
2.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad,and etc.

Product introduction:
Nano-diamond, processed through special treatment, has a high thermal conductivity coefficient, low thermal expansion coefficient, low friction coefficient, and low surface roughness.

Size Available: 50nm-500nm

Application:
1.Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.
2.Thermal Interface Materials(TIM): Thermal gap fillers, Heat conducting films, Thermal Tape, Phase change material, ultra-thin coating materials and etc.