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Thermal Conductive Diamond-Economical

Product introduction:
This product features a relatively regular crystalline form, low impurity content, and high particle concentration.
It has high stability and a high thermal conductivity coefficient, making it a preferred cost-effective filler option.

Size Available: 0.02um-350um

Application:
1.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal putty and etc.