Diamond for Slurry Slicing

This product is crafted from high-quality crushed diamonds, primarily designed for SiC substrate slicing, crystal slicing, and other related fields. It ensures an excellent wafer surface shape index after processing.

Available Sizes: 5/7/10μm, etc.

·High purity ·High slicing rate ·Regular morphology ·Concentrated particle size可供粒度：5/7/10um等。

产品优势：粒度分布均匀、无杂质、寿命高、加工后晶片面型指标出色。