Etching Diamond

This product has a honeycomb structure, primarily used in precision grinding and polishing applications—including SiC, sapphire substrate wafers, optics, ceramics, and alloys—and serves as an alternative to polycrystalline diamond.

Available Particle Sizes: 1-3μm ~ 40-60μm

·Strong holding force ·High self-sharpening ability ·Efficient cutting performance ·Significantly reduces workpiece surface roughness