Product introduction:
This product enhances the stable bonding between metals (such as copper and aluminum, etc) and diamond, reduces interfacial thermal resistance, and thereby improves heat dissipation effectiveness.
Size Available: 1um-1300um
Application:
1.Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.
2.Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad,and etc.